Packaging

SkyHigh Memory Packaging

SkyHigh Memory assembles and tests a wide variety of packages. Examples of these packages include the following: BGA, FBGA, and  TSOP. SkyHigh Memory packaging standard include initiatives in Pb-free/Green packaging, lower cost packaging, and chip scale packaging. All of these initiatives have a foundation built upon the use of "Autolines." World class automation of assembly, test, and finish, combined into one "Autoline" allows SkyHigh Memory to capitalize on quality, cost, and delivery.

In-House Packaging Process Capability

SkyHigh Memory's in-house manufacturing has the most advanced backend manufacturing in the world. Our assembly
line is fully integrated from die attach process to tape and reel process, allowing minimal operator intervention.
This system is equipped with an online inspection system by process steps. It is fully controlled by an MES system that
detects the location of strips while being processed and creates electronic strip maps of reject and good units within
the strip. Typical cycle time is less than a day for the entire assembly, test, and tape reel processes.

Key Features

Pb-Free Packaging

The SkyHigh Memory roadmap to lead-free packages demonstrates our commitment to provide leadership in lead-free
packaging. Lead (Pb) as an alloying element in solders has resulted in environmental concerns due to potential toxicity.
Therefore, various legislations to ban lead are being driven worldwide.

SkyHigh Memory uses nickel-palladium-gold (NiPdAu) technology for the majority of leadframe-based packages.
Long-term packaging roadmaps drive NiPdAu as the preferred solution for Pb-free packages.

A high-level review of the SkyHigh Memory Pb-free position is available (see SkyHigh Memory RoHS Packaging
Compliance letter). Specific package information is also available. Package Material Declaration Datasheets (PMDDs)
identify all substances contained within SkyHigh Memory packages. PMDDs also confirm the absence of many banned
substances. The information in the PMDDs will help SkyHigh Memory customers plan for recycling or other "end of life"
requirements. PMDDs are available by selecting the Package Family, then Information Type (choose Package Materials
Declaration) in the top right Packaging Information portlet.

Standard Plating
  • Snpb [Tin Lead] 300-800 uinch
  • Cooper Leadframe [Cu]
Pure Tin Pb-Free Plating
  • Snpb [Tin Lead] 400-800 uinch
  • Cooper Leadframe [Cu]
NiPdAu Pb-Free Plating
  • Gold [Au] - 0.12~0.5 uinch
  • Palladium [pd] - 0.8~1.2 uinch
  • Nikel [Ni] - 20~80 uinch
  • Cooper Leadframe [Cu]
Lead-Free Standard Marking Format
  1. SkyHigh Company Name
  2. Date Code
  3. Pin1 Identification
  4. Lot Code#
  5. Lead free finish designator
  6. Back End Part Revision
  7. Fab Location
  8. Grade
  9. Package Code
    • “X” in package code indicates a lead-free product
    • “T” suffix in package code indicates Tape & Reel packaging
      (applicable if product is offered in Tape & Reel)
  10. Speed
  11. Marketing Part #

NOTE :
The above diagram is provided for illustrative purposes only. Please note that the actual marking may vary depending on package size and type.
Please contact your local sales representative if you require additional information.

SHM-PAK Program

SkyHigh Memory has implemented a SHM-PAK(TM) program where standard quantities of IC products are prepacked in
trays, tubes or tape-and-reel shipping media.

Ordering products in increments of full SHM-PAK quantities enables SkyHigh Memory and its distributors to quickly and
efficiently fulfill orders. And, by minimizing handling at the finished-goods warehouse, the quality of the products are
preserved when shipped to customers.


For more information about the SHM-PAK program, including details about quantities and packing and shipping
materials, please see our SHM-PAK brochure.

Click here to download the SHM-PAK Packaging Program Brochure.

Published Papers