NAND BASE MCP

Overview

SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.


SkyHigh Memory MCP products are available in densities ranging from 4Gb SLC NAND +4Gb LPDDR4x to 8Gb SLC NAND +8Gb LPDDR4x and offered in small JEDECcompliant 149-ball BGA packages.This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications. MCP NAND Product OverviewPDF | 218 KB

NAND Base MCP Products Highlights

SLC NAND

LPDDR4x

Temperature

Package

Product Datasheets

Documentation table
Part Number Product Status Voltage Density I/O Bus Package Dimension Datasheet
SLC NAND DRAM SLC NAND DRAM NAND
S6AA4411 Production 1.8V 4Gb 4Gb 8 16 WBGA 149
S6AA8803 Production 1.8V 8Gb 8Gb 8 16 WBGA 149