NAND BASE MCP

Overview

SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.


SkyHigh Memory MCP products is currently available in 8Gb SLC NAND +8Gb LPDDR4x configuration and is offered in small JEDECcompliant 149-ball BGA packages. This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
MCP NAND Product OverviewPDF | 973 KB

NAND Base MCP Products Highlights

SLC NAND

LPDDR4x

Temperature

Package

Product Datasheets

Documentation table
Part Number Product Status Voltage Density I/O Bus Package Dimension Datasheet
SLC NAND DRAM SLC NAND DRAM NAND
S6AA8803 Production 1.8V 8Gb 8Gb 8 16 WBGA 149
S6AA1616 Production 1.8V 16Gb 16Gb 8 16 WBGA 149
S6AA0812 Production 1.8V 8Gb 16Gb 8 16 WBGA 149

Design Models

Design Models
Part Number File Title Type Size Last Updated
S6AA8803 S6AA8803_IBIS_MODEL [ZIP] IBIS 72 KB 03/25/2024
S6AA1616 S6AA1616_IBIS_MODEL [ZIP] IBIS 114 KB 03/25/2024